Electronics Forum | Fri Apr 01 14:51:23 EDT 2011 | jaimebc
We are currently experiencing a high rate of false calls on our 0402 chips. Resistors for the most part. Has anybody out there found a setting where this false calls are minimized? We are using top red light, pattern inspection,color inspection ( wh
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Tue May 02 21:01:21 EDT 2000 | Stefan Witte
I forgot to mention the mass placement machine from Nitto. The Nitto machine places all components out of bulkfeeders. Plastic tubes are routed above the feeders pick position and into cavities of a template. The template is made for the pattern of t
Electronics Forum | Wed Feb 13 17:33:07 EST 2002 | Sheri Connor
Hi Dave, I wanted to make sure you have current contact information for us: ScanCAD International, Inc. PO Box 598 19181 Hwy 8 Morrison, CO 80465 Phone: 303.697.8888 Fax: 303.697.8580 Not only do we sell our scanning systems, we also have a Serv
Electronics Forum | Mon Sep 23 10:45:34 EDT 2019 | slthomas
I have seen similar things happen with over etching and bridging but frankly the most common mistake that gives us grief is a failure to use the component manufacturer's recommended land pattern and/or aperture designs. As opposed to generating a n
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
